Abstract
Silicon-containing, plasma-developed resists are characterised by surface (SR) and line-edge roughness (LER) measurements as functions of the exposure dose and plasma development conditions. Specifically, bilayer siloxane-based resists of different molecular weight distributions, and single-layer silylated chemically amplified resists are evaluated with measurements of SR and LER, while the results are compared with those of solution-developed chemically amplified resists. We show that plasma-developed systems can have low LER provided the resist material, the resist chemistry, and the processing conditions are chosen appropriately.
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