Abstract
AbstractPermeation of atomic hydrogen in p-type Si damaged with ion implantation or deposited with polycrystalline or amorphous Si has been studied. Following ion implantation or film deposition, atomic hydrogen was introduced by low energy H ion implantation or from an electron cyclotron resonance (ECR) plasma. Spreading resistance profiles indicate that deactivation of acceptor dopant boron atoms by atomic hydrogen is drastically reduced in silicon wafers with any of the above disordered surface layers, and secondary ion mass spectroscopy (SIMS) traces this reduction to the suppression of hydrogen movement into the crystalline Si substrate. Trapping of hydrogen or formation of molecular hydrogen at defect sites in the surface disordered regions apparently is responsible for this phenomenon.
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