Abstract
AbstractStyrene and 4‐vinylbenzocyclobutene (vinyl‐BCB) random copolymers were prepared by free radical polymerization and studied for suitability as a dielectric material for microelectronic applications. The percentage of vinyl‐BCB in the copolymer was varied from 0 to 26 mol % to optimize the physical and mechanical properties of the cured copolymer as well as the cost. Copolymer in which 22 mol % of vinyl‐BCB was incorporated along with styrene produced a thermoset polymer which, after cure, did not show a Tg before decomposition at about 350 °C. The polymeric material has a very low dielectric constant, dissipation factor, and water uptake. The fracture toughness of the copolymer was improved with the addition of 20 wt % of a star‐shaped polystyrene‐block‐polybutadiene. Blends of the poly(styrene‐co‐vinyl‐BCB) with the thermoplastic elastomer provided material that maintained high Tg of the cured copolymer with only a slight decrease in thermal stability. The crosslinked styrenic polymer and toughened blends possess many properties that are desirable for high frequency‐high speed mobile communication applications. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 2799–2806, 2008
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