Crosslinked copolymer with low dielectric constant and dissipation factor based on poly(2,6‐Dimethylphenol‐co−2,6‐Diphenylphenol) and a crosslinker

Abstract

ABSTRACTThe crosslinked poly(2,6‐dimethylphenol (95 mol %)‐co−2,6‐diphenylphenol (5 mol %)) (poly(2,6‐DMP95‐co−2,6‐DPP5)) was successfully developed as an insulating material separating conducting elements with a low dielectric constant and dissipation factor. The crosslinked poly(2,6‐DMP95‐co−2,6‐DPP5) was prepared by the oxidative coupling polymerization of 2,6‐DMP with 2,6‐DPP, followed by the reaction with 4,4′‐methylenebis[2,6‐bis(methoxymethyl)]phenol (MBMP) as a crosslinking agent. The crosslinked poly(2,6‐DMP95‐co−2,6‐DPP5) exhibited a good thermal stability and glass transition temperature. The dielectric constant and dissipation factor of the crosslinked poly(2,6‐DMP95‐co−2,6‐DPP5) were 2.6 and 0.004 at 10 GHz, respectively. Moreover, a flexible double layer copper clad laminate based on the crosslinked poly(2,6‐DMP95‐co−2,6‐DPP5) composite was successfully prepared, indicating a useful material for high‐speed and high‐frequency electrical applications. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016, 54, 3218–3223