A novel low lose material with thermal reliability for high frequency application

Abstract

The trend for small form factor in electronic devices and systems is driving circuit industry to develop thinner, lighter, smaller interconnects and density, higher speeds and higher frequency. Printed circuit boards, which play a major role in connecting the components and systems, have also adopted high density in circuit layout. Telecommunication and data Communication industries push device, interconnect, and board manufacturers to Higher Speeds. Especially, Bluetooth, WLAN, Server, High speed memory, digital speed exceed 10 Gbps When signals travel at high speed and high frequencies, signal integrity becomes an important issue. In order to reduce transmission loss and the delay of signal propagation on the circuit board, more and more PCB fabricators use laminates with low dielectric constant and low loss properties. The demand of copper clad laminate is also moving to excellent heat resistance, low dielectric constant, dissipation factor and low cost. The resin system with better dielectric properties than standard FR4 for PCBs in high frequency applications was developed. We have developed a novel epoxy formulation which have high Tg, low dielectric constant, dissipation factor and good thermal stability, low water absorption and competitive cost, so they will be satisfy the demands for high frequency communications products and to meet the requirements of PWB manufacturing process for lead free assembly.