Study on ultra-high speed nano-grinding of monocrystalline copper with V-shaped diamond abrasive grains based on molecular dynamics method

Abstract

The process of ultra-high-speed nano-grinding of V-grooves was studied by the molecular dynamics method. It was found that the phenomenon of unequal height on both sides of the V-shaped groove was affected by the rake angle of the abrasive grains. To further explore the mechanism of the influence, five kinds of V-shaped diamond abrasive grains with rake angles of −20°, −10°, 0°, 10° and 20° were used to grind monocrystalline copper, and the forming mechanism of the inconsistent height of the two sides of the V-shaped groove was analyzed in detail. In addition, the distributions of the maximum principal stress, maximum shear stress, hydrostatic stress, and von Mises stress in the grinding were calculated. Consequently, the positive rake grinding can obtain a V-shaped cross-section with a uniform height on both sides. Therefore, the V-shaped abrasive grains with a positive rake angle can be used to obtain a high-quality V-shaped groove.