Abstract
Cosmic radiation has always been the most obvious barrier to planetary travels, especially in long-duration deep space exploration missions. Therefore, the reliability of satellite materials and the requirements of satellite miniaturization have received considerable attention. In this paper, the effect of γ-ray irradiation on the reliability of Sn50Pb49Sb1/Cu solder joints was investigated. It was found that the influence of γ-ray irradiation on the thickness and morphology of the intermetallic compound layer in Sn50Pb49Sb1/Cu was not obvious. However, the formation and growth of micro-voids and micro-cracks was observed in Pb-based solid solutions. Due to the Compton effect, the γ-ray photon could knock the electron out of its orbit, which created the energetic electron. The accumulation of dislocated atoms and lattice vacancies generated by energetic electrons could be the main factor that caused the formation of micro-voids and micro-cracks. The pull force of Sn50Pb49Sb1/Cu solder joints was reduced by 22% after being irradiated at the dose rate of 0.25 Gy(Si)/s for 960 h. Fractographic analysis showed that after irradiation, the fracture type of solder joints was still ductile but the ductility of the solder joints decreased with slightly inconspicuous dimples.
Highlights
Soldering plays an essential role in the manufacture of integrated circuits (IC), supporting the bonding of electrical conduction in integrated circuit interconnections between electrical components and printed circuit boards [1]
Due to a series of satellite processor failures induced by tin whiskers in solder joints, the reliability of electronic device solder joints has become a very important matter in electronic packaging in the past few decades [2,3]
intermetallic compound (IMC) layer is sensitivecompound to the service conditions and the joint is
Summary
Soldering plays an essential role in the manufacture of integrated circuits (IC), supporting the bonding of electrical conduction in integrated circuit interconnections between electrical components and printed circuit boards [1]. Due to a series of satellite processor failures induced by tin whiskers in solder joints, the reliability of electronic device solder joints has become a very important matter in electronic packaging in the past few decades [2,3]. Cosmic radiation induced by the sun, supernovae and other galaxies, is seen as a risk factor for in-orbit satellites [4,5]. According to the reports of National Aeronautics and Space Administration (NASA), the radiation dose rate of low earth-orbit satellites is usually 10–50 Gy(Si)/year, owing to the protection of the atmospheric layer and the magnetic field of the earth. For deep space satellites, the radiation dose may be remarkably increased due to the activity of the sun and other galaxies, Appl.
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