Abstract
Packaging thermal stress is harmful to the performance of the micromechanical silicon resonant accelerometer. In order to decrease the packaging thermal stress, correlations of packaging thermal stress with the material properties, curing temperature and geometrical size of adhesive layers of adhesive materials were discussed. A finite element model of package was developed to analyze the influence of surface mounting technology (SMT） on the micromechanical silicon resonant accelerometer. The simulation results show that the Young’s modulus, thermal expansion coefficient, curing temperature and geometrical sizes of adhesive layers are important influencing factors for packaging thermal stress and the warpage of the chip. The thermal stresses during the process of SMT will cause the resonant frequency shift.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
