Abstract
Surface mounting technology is a key process in MEMS packaging. The finite element model of package structures was established in this paper according to the designed micromechanical silicon resonant accelerometer. The effects of package substrate materials, adhesive material characteristics, uneven adhesive thickness, and adhesive defects on the micromechanical silicon resonant accelerometer were analyzed with ANSYS software. Results showed that the package substrate material strongly affected the resonance frequency of the resonator after the application of surface mounting technology. The Young’s modulus and thermal expansion coefficient of adhesives were found to be important factors that affect chip thermal stress and warpage. Uneven adhesive thickness and adhesive defects also affect the resonance frequency of the resonator. DOI: http://dx.doi.org/10.11591/telkomnika.v11i5.2475
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: TELKOMNIKA Indonesian Journal of Electrical Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
