Abstract
Ternary Zr–Cu–Ti system, especial with a high Ti content, is normally difficult to be fully vitrified. In this paper, we demonstrate that cosputtering can produce amorphous Zr–Cu–Ti thin films with an excessive Ti content even as high as 19%. Sub-Tg annealing of the film induces the formation of medium-range-ordered clusters and to raise the nanohardness by 35% to 6.6GPa. The promising mechanical properties of the sub-Tg annealed Zr52Cu29Ti19 films offer great potential for microelectromechanical system applications.
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