Abstract
Titanium (Ti) thin films with (002) or (100) texture are favored for many applications. In this paper, Ti thin films were prepared by high-power pulsed magnetron sputtering, and the texture of Ti thin films was successfully tailored by adjusting the pulse width, substrate bias and magnetic field strength. It is found that the peak power and average power of the Ti target are increased by increasing sputtering pulse width and decreasing magnetic field strength, which raise the Ti plasma flux and ion/atom ratio of Ti ions in front of the substrate simultaneously. Ti thin films with a highly (002) out-of-plane texture can be obtained with higher pulse width and lower magnetic field strength. The Ti thin films with highly (100) out-of-plane texture can be achieved with shorter pulse width, lower magnetic field strength and substrate bias.
Published Version
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