Abstract
We evaluated the morphology and crystallinity of copper films which were grown by the new chemical vapor deposition (CVD) method with Cl2 plasma using field emission scanning electron microscopy (FESEM) and electron back scattering pattern (EBSP). The obtained films consisted of large grains of 0.5–1 µm size, and filling with high crystallinity was indicated. Moreover, we observed the time evolution of the morphology of the films by FESEM. On the basis of the results, the mechanism of the copper film growth and the bottom-up filling by the new CVD method was discussed.
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