Structural and electrical studies on Ti/Al-based Au-free ohmic contact metallization for AlGaN/GaN HEMTs

Abstract

In order to fabricate the AlGaN/GaN-on-Si HEMTs on existing Si-CMOS production lines, manufacturing processes must meet the rigors of Si-CMOS technology eliminating Au. One of the requirements is formation of Au-free, low resistivity ohmic contacts to AlGaN/GaN heterostructures. In this work we report structural and electrical studies of Ti/Al-based ohmic contacts to AlGaN/GaN HEMTs with TiN/Cu cover layers. Ohmic contacts have been observed after annealing of Ti/Al/TiN/Cu or Ti/Al/Ti/TiN/Cu/TiN multilayers on recessed AlGaN/GaN structure at temperature of 550 °C, specific contact resistance is about 2.3 × 10−4 Ω cm2, however, lower value was obtained after annealing at 750 °C. The XRD and TEM studies reveal formation of additional phases during annealing, namely Al3Ti and Ti2AlN inside the volume of the metallization stack and AlN at metal/GaN interface. Measured dependence of contact resistance on temperature suggests a “metal-like” carrier transport mechanism in partially recessed Ti/Al/Ti/TiN/Cu ohmic contact to 2D electron gas.