Abstract
Measurements were made of the tensile residual stress in vapor-deposited nickel in the thickness range 150 to 1360 Å. Films were evaporated onto glass substrates at pressures less than 3×10 -5 torr and deposition rates of between 20 to 40 Å sec -1. Stress was determined by measuring the deflection of a cantilever beam substrate. A decided dependence of “average” residual stress on film thickness was observed. The thermal contribution to measured stress was found to be less than 6%. The errors inherent in the cantilever beam method are discussed and a relation between residual stress and the flow stress of nickel films is proposed.
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