Strength Evaluation of Bonded Plate by the Fictitious Crack Method

Abstract

In this study, the stress intensity factor of the crack near the interface in the adhesive bonded plate is analyzed and the interface strength evaluation of different material bonded plate is examined. A small edge crack near the interface is strongly controlled by the singular stress field at the interface end. The stress intensity factor of the crack near the interface in adhesive bonded plate is analyzed by changing the length and distance of the crack and the bond line thickness systematically. Based on the singular stress at the crack tip position, the approximate solution is presented. From the obtained results, the relationship between the critical stress intensity factor KIC and the interface strength is discussed. The critical stress intensity factor evaluated by the fracture stress converges to a constant value regardless of the bond line thickness. In other words, the stress intensity factor of the edge crack near the interface is the alternative parameter of the intensity of the singular stress field at the interface end, and it is useful for evaluating the adhesive strength of the bonded specimens.