Abstract
Strain imaging is a critical aspect in the design and characterization of opto-electronics, microelectronics, flexible electronics, and on-chip photonics. However, strain mapping techniques are often material specific and strain measurements in amorphous materials remain a challenge. Here, we demonstrate strain mapping and optical characterization of an amorphous semiconductor using scanning reflectance anisotropy microscopy. Using reflection anisotropy spectroscopy and finite element simulations on evaporated amorphous germanium films, we showcase the strain sensitivity of the ellipsometric parameters. We demonstrate nondestructive mapping for simple and complex strain states in amorphous systems. The sub-degree phase and amplitude sensitivity of the microscope is able to determine strain states on the order of 10−3.
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