Abstract

In nanometer scale CMOS parameter variations are a challenge for the design of high yield integrated circuits. Statistical Timing Analysis techniques require statistical modeling of logic blocks in the netlist in order to compute mean and standard deviate for system performance. In this work we propose an accurate and computer efficient methodology for statistical modeling of circuit blocks. Numerical error propagation techniques are applied to model within-die and die-todie process variations at electrical level. The model handles co-variances between parameters and spatial correlation, and gives as output the statistical parameters that can be applied at higher level analysis tools, as for instance statistical timing analysis tools. Moreover, we develop a methodology to compute the quantitative contribution of each circuit random parameter to the circuit performance variance. This methodology can be employed by the designer or by an automatic tool in order to improve circuit yield. The methodology for yield analysis proposed in this work is shown to be a solid alternative to traditional Monte Carlo analysis, reducing by orders of magnitude the number of electrical simulations required to analyze memory cells, logic gates and small combinational blocks at electrical level. As a case study, we model the yield loss of a SRAM memory due to variability in access time, considering variance in threshold voltage, channel width and length, which may present both dieto-die and within-die variations. We compare results obtained using the proposed method with statistical results obtained by Monte Carlo simulation. A speedup of 1000× is achieved, with mean error of the standard deviate being 7% compared to MC.

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