Abstract
In this work we investigate degradation effects occurring on soft PDMS stamps while performing UV enhanced substrate conformal imprint lithography (UV-SCIL) with dual-curing UV Sol–Gel resists. First, we describe and optimize the imprint process to obtain an optimum curing time for a given layer thickness and imprint pattern. With this set of optimized parameters we investigate the physical degradation of the stamp during multiple imprinting runs and could show that diffusion of resist components is in the end a limiting factor for the end of life of a stamp in an imprint cycle. The use of optimized imprint parameters guarantees high pattern accuracy and enables us to reach the shortest cycle time reported so far for SCIL of 3min 30s for 75 consecutive imprints.
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