Abstract
We report on the results of an experimental comparison of different types of squeegee blade used in the stencil printing of solder pastes for reflow soldering in SMT, concentrating on paste heights (scooping) and printing defects. We show how our experimental results for squeegee deformation into stencil apertures lead to the construction of a model for squeegee deformation. The model takes into account the force on the squeegee due to solder paste flow and some of the non-Newtonian properties of the solder paste. An explanation is proposed for the differences in paste heights between apertures of different orientations. >
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
