Application of ink screening models to solder paste printing in SMT assembly

Abstract

The need for a better understanding of the solder paste printing process is argued. Similarities and differences between on-contact stencil printing of solder pastes and off-contact screen printing of inks are discussed. Various models of the screen printing process are reviewed and those calculations and ideas relevant to stencil printing of solder pastes highlighted. Some predictions from the ink screening models are checked to see whether they still apply to stencil printing, and areas for further research are outlined.