Spark plasma sintering of sub-micron copper reinforced with ruthenium–carbon nanotube composites for thermal management applications

Abstract

Submicron copper reinforced with carbon nanotubes–ruthenium composites as suitable material for thermal management applications has been fabricated by Spark plasma sintering (SPS). The slurry of CNT–Ru was uniformly dispersed into copper matrix by mechanical stirring process using ethanol as a mixing medium. The composites powders were initially annealed for 30min at 550°C with heating rate of 5°C/min under argon. The annealed powders were then consolidated at sintering temperature of 600°C and 650°C with a constant pressure of 50MPa and the holding time of 5min. The relative density of 98.15% was obtained for Cu-2vol%CNT while that of Cu-2vol%CNT-0.5vol%Ru was of 97.08%. The Vickers hardness values of Cu-2vol%CNT-0.5vol%Ru sintered at 650°C were found to be 130.4HV. The coefficient of thermal expansion of 2.3×10−6/°C was measured for copper reinforced with 2vol% CNT sample at 100°C. The thermal conductivity of 323W/mK and 279W/mK was measured at 100°C for Cu and Cu-1CNT-0.5vol%Ru. The X-ray photoelectron spectroscopy was performed on the samples surface in order to determine the effect of additives on the copper surface. XPS revealed that addition of Ru reduced copper oxidation at the surface.