Thermal properties of carbon nanotube-copper composites for thermal management applications.

Ke Chu,Fazhang Yin,Xuebing Liang,Ximin Zhang,Hong Guo,Hui Chen,Chengchang Jia

doi:10.1007/s11671-010-9577-2

Abstract

Carbon nanotube–copper (CNT/Cu) composites have been successfully synthesized by means of a novel particles-compositing process followed by spark plasma sintering (SPS) technique. The thermal conductivity of the composites was measured by a laser flash technique and theoretical analyzed using an effective medium approach. The experimental results showed that the thermal conductivity unusually decreased after the incorporation of CNTs. Theoretical analyses revealed that the interfacial thermal resistance between the CNTs and the Cu matrix plays a crucial role in determining the thermal conductivity of bulk composites, and only small interfacial thermal resistance can induce a significant degradation in thermal conductivity for CNT/Cu composites. The influence of sintering condition on the thermal conductivity depended on the combined effects of multiple factors, i.e. porosity, CNTs distribution and CNT kinks or twists. The composites sintered at 600°C for 5 min under 50 MPa showed the maximum thermal conductivity. CNT/Cu composites are considered to be a promising material for thermal management applications.

Highlights

Carbon nanotubes (CNTs) possess a unique structure and properties that have attracted significant interest worldwide [1, 2]
Theoretical analyses revealed that the interfacial thermal resistance between the CNTs and the Cu matrix plays a crucial role in determining the thermal conductivity of bulk composites, and only small interfacial thermal resistance can induce a significant degradation in thermal conductivity for CNTsreinforced Cu matrix (CNT/Cu) composites
The composites sintered at 600°C for 5 min under 50 MPa showed the maximum thermal conductivity

Summary

Introduction

Carbon nanotubes (CNTs) possess a unique structure and properties that have attracted significant interest worldwide [1, 2]. 50 5 f is the CNT volume fraction; T is the sintering temperature (oC), P is the applied pressure (MPa), t is the holding time; RD is the relative density (%), and TC is the thermal conductivity (W/mK)

Results

Conclusion