Solutions for Low Cost, Near Hermetic Air Cavity Packages

Abstract

The introduction of 5G networks includes both Macro Cell and Multiple-input, Multiple-output (MIMO) systems. Unique plastic air cavity solutions are available for both system types that address the continuous need for cost reduction while meeting high-frequency requirements. For today’s Air Cavity applications, expensive hermetic packaging is no longer required. Near hermetic, low-cost plastic packaging is replacing expensive ceramic packages and thus providing customers with reduced costs and faster time to market. In the Macro Cell space GaN Power Amplifiers (PA) are ramping to high volume production in 5G networks. The use of a Plastic air cavity package along with a copper flange vs a CPC flange provides the lower costs than ceramic packages while delivering better performance compared to an overmolded solution. RJR provides the package sidewall that attaches to the flange. A lid composed of low-cost LCP (Liquid Crystal Polymer) attaches to the sidewall to complete the package assembly. Today’s Plastic air cavity, medium power package solutions can meet the requirements of Multiple-input, Multiple-output (MIMO) antenna arrays used in the 5G network, to be able to deliver high data rates to multiple users in dense urban areas. The package solution consists of a matrix lid panel that is attached to a populated PCB substrate. The packages described above are enabled with RJR proprietary B-stage epoxy. The use of the proper B-stage epoxy delivers a near-hermetic solution. The package assembly is completed by using a defined process technique that specifies time, temperature and pressure, that can utilize RJR’s Isothermal Seal Machines. This paper will provide insight on the plastic air cavity packages available for 5G applications along with reliability data and information on multi chip laminate solutions with a matrix air cavity lid that aids in lower assembly costs.