Abstract
An organic thin film back-gated transistor (OBGT) was fabricated and characterized. The gate electrode was printed on the back side of substrate, and the dielectric layer was omitted by substituting the dielectric layer with the polyimide (PI) film substrate. Roll-to-roll (R2R) gravure printing, doctor blading, and drop casting methods were used to fabricate the OBGT. The printed OBGT device shows better performance compared with an OTFT device based on dielectric layer of BaTiO3. Additionally, a calendering process enhanced the performance by a factor of 3 to 7 (mobility: 0.016 cm2/V·s, on/off ratio: 9.17×103). A bending test was conducted to confirm the flexibility and durability of the OBGT device. The results show the fabricated device endures 20000-cyclic motions. The realized OBGT device was successfully fabricated and working, which is meaningful for production engineering from the viewpoint of process development.
Highlights
Printing technology has received attention for traditional media printed goods and in the area of electronic device production
There are various printed electronic devices; typically, organic thin film transistors (OTFTs) are among the most researched in recent trends.[1,2]
The dielectric printing process was omitted by using the PI film substrate as a dielectric layer
Summary
Printing technology has received attention for traditional media printed goods and in the area of electronic device production. There are various printed electronic devices; typically, organic thin film transistors (OTFTs) are among the most researched in recent trends.[1,2] Printed OTFTs are have several advantages such as simple process steps, low cost, high throughput, and roll-to-roll (R2R) applicability.[3,4,5,6] Existing OTFTs are promising for flexible display products as used in backplane driving elements, unlike brittle a:Si-H based conventional TFTs.[7] Traditional TFTs are not durable enough to fabricate on flexible displays because of their inflexibility and tendency to cracking.[8] organic materials emerged to replace the conventional materials; one of their great advantages is that they are soluble materials that make possible the printing process. Most OTFT research is aimed at fabricating the devices using printing methods, so interface adhesion of multi-layer printing structures is highly important.[9,10] The printed layer, especially in R2R-processed products, meets the various bending angles through the several rollers that cause bending stress in each layer.[11,12]
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