Abstract
The growth kinetics of the intermetallic compound layer formed between Sn-8Zn-3Bi solder and a bare Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 423 K for periods ranging from 0 to 100 days. A quantitative analysis was performed of the intermetallic compound layer thickness as a function of the aging time and aging temperature. For the identification of the intermetallic compounds, both Energy Dispersive X-ray and X-Ray Diffraction were employed.
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