Abstract
The liquid–solid reaction between Sn3Ag0.5Cu and Au/Pd(P)/Ni(P) tri–layer with three different joint diameters (djoint), 200μm, 150μm, and 60μm, were investigated in this study. The reaction product(s) strongly depended on djoint. In the case of djoint = 200μm, the predominant product after reaction at 245oC for 80s was a continuous (Cu,Ni)6Sn5. When djoint slightly reduced to 150μm, a mixture of (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 grew at the interface. When djoint further reduced to 60μm, the (Cu,Ni)6Sn5 was completely replaced by (Ni,Cu)3Sn4. Moreover, a significant amount of isolated (Pd,Ni)Sn4 domains scattered inside the solder matrix near the interface. The transition of the microstructure was attributed to the decrease of Cu concentration (CCu) and increase of Pd concentration (CPd) as djoint reduced. This finding suggests that the solder volume is an important factor in determining the microstructure of solder joints.
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