Abstract
AbstractCompared with Sn-based solders, the In-Pb solders have better fatigue resistance. The great advantage of In-Pb solders is that gold dissolves more slowly in In-Pb solders than in Sn-based solders. To evaluate the reliability of In-Pb solders, in this paper, the microstructure and properties of In25Pb75 solder joints during aging and temperature cycling test was studied. The microstructure of the solder joints was observed by Scanning Electricity Microscope (SEM). The results show that there is a thin layers of the intermetallic compound in the middle of solder joints. The solder joints were aged at 200 ℃ for different time. After aging the shear mechanics performance of the solder joints was tested by a shear force tester. The results showed that the shear strength of the solder joints first increased and then decreased as aging time increased. The reliability of solder joints was estimated by temperature cycling test. After temperature cycling, the shear strength of the solder joints was tested by a shear force tester. The results show that the shear strength of the solder joints declines sharply after temperature cycling by a drop of 10%.KeywordsSolder jointsMicrostructureIntermetallic compoundShear strength
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