Abstract
THE MARKET FOR CHEMICALS used in semiconductor manufacture is begirining to rebound after a two-year slump, and nowhere is this more true than in the chemical mechanical planarization (CMP) slurries that are used to smooth and planarize chip-bearing silicon wafers. A wide range of chemical companies are fighting to carve out slices of the growing market for CMP slurries and the polymerbased pads used to apply them. But they are all bumping up against industry leaders Cabot Microelectronics in slurries and Rodel in pads. CMP is little more than high-tech sanding. The typical CMP slurry contains water, a colloidal or fumed silica abrasive, surfactants, organic acid complexing agents, a corrosion inhibitor such as benzotriazole, biocides, hydrogen peroxide, and an amine-based solublizing agent. Eight- and 12-inch silicon wafers on which semiconductors are being made are placed in this slurry and pressed against a CMP pad that is typically made of polyurethane. ...
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