SEMI Standards for Consumables for Chemical Mechanical Planarization (CMP)

Abstract

IC manufacturing is a sophisticated multistep process where parameters need to be monitored and controlled very tightly. Chemical-mechanical polishing (CMP) is an important step in IC manufacturing that is required to achieve global and local planarity for subsequent lithography processes. CMP has been one of the fastest-growing segments of the semiconductor industry for the past 20 years.The CMP process is highly critical for achieving sustainable yields in IC manufacturing. This area is also one of the most difficult to control. Quality issues in the CMP process are extremely expensive and can have a significant impact to device yields and reliability. It is known that CMP consumables, such as CMP pads, CMP slurries, and CMP conditioning disks are critical to achieve the target performance in IC manufacturing processes. As such, reducing the variations in CMP consumables properties through standardized metrology tools and processes has become a high priority for advanced IC manufacturing nodes.In this presentation we will focus on measuring and reporting critical parameters for such critical and widely used consumables in the CMP industry, as CMP pads ([Ref. 1-4]), retainer rings, and conditioning disks.Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.For more information please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.Standards WatchSEMIwww.semi.org<12/03/2020>