Abstract
Wafer level packaging is an important development trend for IC package design. The fan-out wafer level package discussed here has the flip chip form which uses thin-film redistribute then uses solder bump to connect the package to the printed wiring board directly. Liquid compound was used for the encapsulation process. Comparing with wire-bond BGA, the fan-out wafer level package has better electric properties, lower power consumption, and smaller package size.
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