Abstract
Silver is the material of choice for printed electronics. However, dispersed silver particles can block the fine nozzles of an inkjet print head and after printing the patterns have to be sintered at elevated temperatures to provide high conductivity. In this work we investigated and optimized the printing of a reactive silver ink which contains silver in complexed form, therefore avoiding disadvantages of particle dispersions. After printing the complexed silver is transferred into metallic by evaporating the complexing ligands at 50°C. The ink contains around 11% silver and has a surface tension of 26mNm−1. It is stable for at least 1month at room temperature and for at least 3months at 2–8°C. The ink was tested on several substrates and an application on textile is shown. The inkjet printed electronic circuit paths on the fabric withstand washing tests, moisture, and heat as well as crumpling.
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