Abstract
Silver is the material of choice for printed electronics. However, dispersed silver particles can block the fine nozzles of an inkjet print head and after printing the patterns have to be sintered at elevated temperatures to provide high conductivity. In this work we investigated and optimized the printing of a reactive silver ink which contains silver in complexed form, therefore avoiding disadvantages of particle dispersions. After printing the complexed silver is transferred into metallic by evaporating the complexing ligands at 50°C. The ink contains around 11% silver and has a surface tension of 26mNm−1. It is stable for at least 1month at room temperature and for at least 3months at 2–8°C. The ink was tested on several substrates and an application on textile is shown. The inkjet printed electronic circuit paths on the fabric withstand washing tests, moisture, and heat as well as crumpling.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
