Abstract

Progress on the technological and economical assessment of ribbon growth of silicon by a capillary action shaping technique is reported. Progress in scale-up of the process from 50 mm to 100 mm ribbon widths is presented, the use of vitreous carbon as a crucible material is analyzed, and preliminary tests of CVD Si/sub 3/N/sub 4/ as a potential die material are reported. Diffusion length measurements by SEM, equipment and procedure for defect display under MOS structure in silicon ribbon for lifetime interpretation, and an assessment of ribbon technology are discussed. (WHK)

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