Silicon Carbonitride Films Produced by Remote Hydrogen Microwave Plasma CVD Using a (Dimethylamino)dimethylsilane Precursor

Abstract

Amorphous hydrogenated silicon carbonitride (a-Si:C:N:H) films were produced by remote microwave hydrogen plasma CVD (RP-CVD) using (dimethylamino)dimethylsilane as a single-source precursor. The reactivity of the precursor with atomic hydrogen was characterized using (dimethylamino)trimethylsilane as a model compound. The effects of the substrate temperature (TS) on the kinetics of the RP-CVD process, and the chemical composition and structure of the resulting film, have been investigated. The temperature dependencies of the mass- and thickness-based film growth rates imply that, for a low substrate temperature range (TS = 30–100 °C), film growth is limited by desorption of film-forming precursors, whereas in a high substrate temperature range (TS = 100–400 °C) film growth is independent of the temperature, and the rate of RP-CVD is mass-transport limited. The increase of the substrate temperature from 30 °C to 400 °C causes the elimination of organic moieties from the film and the formation of a Si–N and Si–C network structure. The films produced at TS = 300 °C were found to be dense materials exhibiting excellent morphological homogeneity, high hardness, and an extremely low friction coefficient. In view of these properties, a-Si:C:N:H films produced by RP-CVD seem to be promising coatings for tribological use.