Signal Integrity and Power Integrity Properties of FCBGA Based on Ultra-Thin, High-Density Packaging Substrate

Abstract

We developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that consists only of build-up layers without a core laminate. We evaluated the signal integrity and power integrity properties of a flip-chip ball grid array (FCBGA) based on the MLTS, along with those of an identically functioning FCBGA based on conventional build-up printed wiring board (PWB). Our signal-integrity simulation clearly showed that the return loss (S11) of the MLTS was 6 dB smaller than that of the PWB in the frequency range from 1 to 10 GHz. In our power-integrity simulation, the noise transmitted inside the MLTS was 13 dB smaller than that inside the PWB at 10 GHz. These results indicate that the MLTS has considerable advantages over a conventional build-up PWB, especially for operation in the GHz range.