Signal and Power Integrity Co-Simulation of HBM Interposer in High Density 2.5D Package

Abstract

In this paper, the correlation high speed signal and power integrity simulation and analysis of high bandwidth memory interface in high density 2.5D package is presented. Firstly, the concept of 2.5D package and the major advanced package technologies of wafer foundry and OSAT are introduced. Secondly, the detailed JEDEC HBM interface standard including channel definition, electrical characteristic and package specification is proposed. Thirdly, aims to the typical high density 2.5D package, the HBM signal channel model and power distribution network model are extracted respectively. Finally, the correlation simulation including the transmitter IO model, signal channel model, power distribution network model and the receiver load is set up to performer the SI and PI simulation and analysis of the proposed 2.5D package. Specifically, the signal and power integrity simulation is presented to evaluate signal waveform, eye diagram and power supply fluctuation noise. In particular, the simulation results are compared and analyzed between the ideal power supply and the actual interposer, substrate and PCB multistage power supply. The simulation results show the the signal an power integrity co-simulation can represent the power fluctuation noise of power distribution system. At the same time, the influence of power supply noise on the HBM signal channel can be characterized followed by the eye height is reduced by 10.5% and the eye width is reduced by 4.2%, which means the proposed signal and power integrity co-simulation is very necessary to assess the electrical performance of HBM interface accurately. It is expected that the presented signal and power integrity co-simulation analysis method could be widely adopted in HBM 2.5D silicon interposer, package substrate layout design and SI/PI analysis.