Abstract
We have developed a simple technique for wafer bonding for use with stepper-based lithography. The technique involves side-by-side bonding of two or more pieces of a wafer together with epoxy. A bonded wafer with the same dimensions, such as thickness, flatness, and position of the large flat, as a whole wafer can be run on a stepper. Since a stepper can align each field independently, all of the area without the actual bond may be patterned. This technique is quite useful for salvaging a broken wafer in the middle of processing. In addition, it may be used for bonding several substrates of different materials together for monolithic integration.
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