Abstract
Silver sintered die attach materials offer a new interconnect technology. Hybrid sintering die attach paste is resin-based and has the same application as standard die attach paste applications, but it does not require high pressure and high temperature for sintering. It features excellent workability that enables stable application for 24 continuous hours, without silver sedimentation or separation. Lead-free die attach materials that offer simplified processing, robust reliability and best-in-class thermal and electrical performance for high power semiconductor packages. SiC is next generation Wide Band Gap semiconductor material for high temperature power electronics for automotive and telecommunication. We would like to introduce a SiC die attach based on sintering solution for WBG packages. Features is thermal conductivity >200 W/m.k, pressure less die attach process, low temperature cure under nitrogen atmosphere, and any treated surface excellent adhesion to all treated surfaces.
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