Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling

Abstract

The shear strength behaviors of Anisotropic Conductive Adhesive Film (ACF) joints were investigated experimentally with various environments. The shear tests of ACF joints were performed at different constant temperature conditions. It is found that the shear behaviors of the ACF joints are strongly dependent on testing temperature, and the shear strength decrease and the maximum displacement increases with increasing temperature. The shear strength of ACF joints was also investigated under hygrothermal aging and thermal cycling. The results show that the shear strength of ACF joints gradually decreases at first, then quickly decreases and finally the rate of decrease slows down again with increasing hygrothermal aging time. However the shear strength of ACF joints after thermal cycling increases firstly and then decreases with increasing thermal cycling time.