Semiconductor FAB layout design analysis with 300-mm FAB data: “Is minimum distance-based layout design best for semiconductor FAB design?”

Abstract

In this paper, one of the most common layout design approaches in general factory design – minimum flow-weighted distance (min-distance) layout – is verified for semiconductor fabrication facility (FAB) design. In min-distance layout design, machines or workstations with high flow rates are allocated close to each other to minimize the total distance of the material flow. This approach is widely used in various industries including semiconductor manufacturing. However, some research also discusses the drawbacks of this approach due to flow congestions and heavy traffic in material handling systems. We validate the min-distance approach with actual data from a modern 300-mm DRAM FAB. We logically generate 18 different cases with different layouts, overhead hoist transport track configurations, and production scenarios. The effectiveness and drawbacks of the min-distance approach in FAB design is investigated with these cases. From the simulation analysis using the Design of Experiments method, we logically show that the performance of material delivery is sensitive to the production volume in the min-distance layout. Also, the performance of the min-distance layout is significantly degraded when the volume is heavy; however, performance can be improved considerably with a few modifications to the bays. We also provide practical tips for an effective layout design method from the insight gained from the simulation analysis. This paper contributes to the critical analysis of the conventional layout design method and the identification of its effectiveness and limitations by using actual FAB data.