Abstract
Due to the increased demand for GaAs substrates, improved physical characteristics such as warp, flatness, local thickness variation and other parameters are required. In the first of a 3-part series III–V Review continues its coverage of the round-robin testing of GaAs by Japanese substrate suppliers [1]. In this article we cover warp and bow, in part II next issue we report on total thickness variation (TTV) and total indication reading (TIR), and then in the concluding part we cover local thickness variation (LTV) and percentage local thickness variation (PLTV).
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