Abstract
The smaller dimension devices and larger scales of integration are demanding constant reduction of the macroscopic and microscopic defects in the manufacturing of silicon integrated circuits. Increasing capital investment in manufacturing is forcing us toward processes and equipment that are effective not only in reduction of the cost of ownership but can also increase the effectiveness of equipment of current as well as future applications. Rapid thermal processing (RTP) based on incoherent light as the source of energy is playing an important role in the manufacturing of 300 nm and larger diameter wafers. The dominance of ultraviolet and vacuum ultraviolet photons in RTP results in rapid photothermal processing (RPP). The results presented in this paper show that the materials and devices processed by RPP are better than those processed by other thermal processes. This paper discusses the manufacturing science, operating principles of RPP and experimental results supporting its role in future process integration.
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