Abstract
AbstractThis paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full‐wave analysis. A novel port configuration is used in finite‐element simulation. Agreement between measurement and simulation is found to be excellent. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 399–401, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11229
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