Abstract
As SAW filters move to higher frequencies and smaller sizes, the packaging structure has an increasing effect on the electrical performance of the device. In order to correctly design a SAW filter, the package performance must be considered concurrently in the design process. This paper describes several new methods for package simulation in which a full-wave electromagnetic (EM) simulator is used to create a package model. A ceramic chip and wire package is used to demonstrate the techniques. The package model is combined with a model of a SAW ladder filter at 1960 MHz and compared to measured data. The full-wave simulation is first performed on an empty package, with inductors used to represent bond wires. More accuracy can be achieved if simplified bond wires are included in the full-wave analysis, although computation time increases. A more accurate model of the bond wire shape increases simulation time, with no increase in accuracy. Our results demonstrate that full-wave analysis techniques are useful for predicting critical parameters such as the shape and rejection level of a SAW filter.
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