Electrical analysis and simulation solution for RF SAW filter package

Abstract

Based on low cost package, LG innotek' packaging technology is adopted the flip chip technology. Because of long term and expensive test process, predicting package charateristics before the package development cycle is very important design issue. In this paper, we describe a procedure used to predict the frequency responses of RF SAW filter enclosed in 2.5x2.0 mi surface mount type ceramic package. The DCN Rx pass hands are between 869MHz and 894MHz and insertion loss is 2.2dB. We synthetically presented a simulation method of SAW package which has proper design of ground layer, number of via, area of covered ground plane, effect of field distribution and seperation placement of SAW resonator. The ground analysis models can he made separate from the signal analysis model. It may take one of several forms. These different forms depend on the various package type which is overlapped ground planes and via locations. The proposed RF SAW package is optimized by 3D EM simulation. The measured RF SAW filter agree well with those obtained from EM and circuit simulation involved equivalent circuit. Because the parasitic electromagnetic element can be predicted and take into account already in the design phase, the specifications can he met more reliably and thus the number of expensive test cycles may be reduced.