Similar Papers

Paper Title
Journal
Date
Author
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
Periannan Arulvanan ... Xunqing Shi
Microelectronics Reliability | VOL. 46
Periannan Arulvanan, et. al.Periannan Arulvanan ... Xunqing Shi
16 Jun 2005
Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test
Deok-Hoon Kim ... S Barrett
IEEE Transactions on Electronics Packaging Manufacturing | VOL. 25
Deok-Hoon Kim, et. al. Deok-Hoon Kim ... S Barrett
01 Apr 2002
Solder joint lifetime assessment of electronic devices
K Heiduschke
International Journal for Numerical Methods in Engineering | VOL. 41
K HeiduschkeK Heiduschke
30 Jan 1998
Microstructure and performance evolution of SnPbSb solder joint under γ-ray irradiation and thermal cycling
Jianhao Wang ... Siyi Liu
Journal of Materials Science: Materials in Electronics | VOL. 30
Jianhao Wang, et. al.Jianhao Wang ... Siyi Liu
02 Feb 2019
View more papers

More From: Journal of Materials Science

Paper Title
Journal
Date
Author
Performance and hydration mechanism of β-hemihydrate phosphogypsum with granulated blast furnace slag and carbide slag
Qishi Zhou ... Haodi Chen
Journal of Materials Science | VOL. -
Qishi Zhou, et. al.Qishi Zhou ... Haodi Chen
15 Jan 2025
In-situ characterization of temperature-dependent domain structure and permittivity of KTN crystals with applied field
Wendie Chen ... Xuping Wang
Journal of Materials Science | VOL. -
Wendie Chen, et. al.Wendie Chen ... Xuping Wang
15 Jan 2025
Enhanced surface transport properties of high-quality ultrathin epitaxial Bi2Te3 films
Jian Gao ... Zhidong Zhang
Journal of Materials Science | VOL. -
Jian Gao, et. al.Jian Gao ... Zhidong Zhang
15 Jan 2025
The physical properties of new MAX phase Zr3XC2(X=Cd, Sb): A DFT investigation
Lei Sun ... Yong Cao
Journal of Materials Science | VOL. -
Lei Sun, et. al.Lei Sun ... Yong Cao
15 Jan 2025
View more papers

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.