Abstract
The continuum mechanical and constitutive description of eutectic tin–lead(–silver) solder is discussed with respect to the expected mean lifetime of solder joints of electronic devices under thermal cycling conditions, especially, the creep damage evolution in the joints. Since the mechanical loads are introduced into the model by thermal loads and due to the thermal expansion mismatch of different components, the solder joints are modelled by fine meshes of non-linear triangular finite elements, whereas the remaining surrounding structure is modelled by linear beams, linear quadrilaterals and specific compatibility elements. The strain-rate and temperature-dependent creep evolution and stress–strain relations of tin–lead(–silver) are presented in tensorial form. A hypothesis of the creep damage evolution is also offered. Simulation results on the creep damage evolution in solder joints of quad flat packs (QFP) with gull wing leads are discussed and compared with thermal cycling experiments. © 1998 John Wiley & Sons, Ltd.
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