Abstract
In order to decrease the development costs, shorten the developing cycle, improve the overall performance and reduce the environmental pollution of the wafer precision grinding machine, the structure, transmission, movement of grinding system for wafer precision grinding machine is analyzed based on mechanical system mechanics, the three-dimensional model of the grinding system is established, based on frame animation technology and via secondary development of Pro/E in the environment of VS 2008, the virtual prototype of grinding system for wafer precision grinding machine is developed, the kinematics and dynamics simulation of the grinding system is realized.
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