Abstract
A three-level model of microbolometer was established by the software of intellisuit. Device thermal conductance Gdev, effective thermal conductance Geff and the theoretical value of device thermal conductance Gthe can be obtained by means of dynamic thermal finite element simulation, dynamic thermoelectric coupling finite element simulation and theoretical calculations respectively. And then the three parameters mentioned above were analyzed and conclusion can be drawn that effective thermal conductance Geff extracted not only can provide some important references for design of microbolometer, but also be more accurate in performance estimating of the device.
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