Abstract
The electroplated diamond wire saw made from high-carbon steel wire busbar (busbar), which directly affects the quality of cutting monocrystalline silicon, polysilicon, sapphire and SiC. When the wire diameter is on the micro-scale, there is no equipment to precisely measure the distribution of residual stress at present. The free circle diameter (FC-diameter) is used as the quality index to measure the distribution of axial residual stress of the busbar post-drawing. The existing finite element simulation of residual stress of steel wire post-drawing is mainly aimed at steel wire diameter of millimeter, and most of it is two-dimensional finite element simulation. The effect of actual factors on residual stress of the busbar is not considered in the simulation. In this paper, finite element simulation is carried out for steel wire with diameter in micron scale. The influences of die deflection, die friction coefficient, die sizing band ellipse and steel wire ellipse on axial residual stress is considered. The relationship between residual stress distribution and FC-diameter is established, and the correctness of simulation results is verified by experiments.
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