Abstract
Recent development of the extremely light-weight micro pore optics based on the semiconductor MEMS (Micro Electro Mechanical System) technologies is reported. Anisotropic chemical wet etching of silicon (110) wafers were utilized, in order to obtain a row of smooth (111) side walls vertical to the wafer face and to use them as X-ray mirrors. To obtain high performance mirrors with smooth surfaces and a high aspect ratio, several modifications were made to our previous manufacturing process shown in Ezoe et al. (2005). After these improvements, smooth surfaces with rms roughness of the order of angstroms and also a high aspect ratio of 20 were achieved. Furthermore, a single-stage optic was designed as a first step to multi-stage optics. A mounting device and a slit device for the sample optic were fabricated fully using the MEMS technologies and evaluated.
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